Q-Tech QTV706 Sine Wave User Manual

Page 5

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QTV704, QTV705 and QTV706

DDIP Sine-Wave

REV.

Q-TECH Corporation

10150 W. Jefferson Blvd.
Culver City, CA 90232

SIZE

A

CAGE NO.

51774

Sheet 5 of 7

1.0

3.3.1 All piece parts shall be derived from lots that meet the element evaluation requirements of MIL-PRF-

38534, Class K, with the exception of the following exceptions:

Active elements

a) Visual inspection of silicon on sapphire microcircuits. Semicircular crack(s) or multiple adjacent

cracks, not in the active area, starting and terminating at the edge of the die are acceptable.
Attached (chip in place) sapphire is nonconductive material and shall not be considered as foreign
material and will be considered as nonconductive material for all inspection criteria.

b) Subgroup 4, Scanning Electron Microscope (SEM) inspection. The manufacturer may allow the die

distributor, at his option, to select two (2) dice from a waffle pack (containing a maximum quantity
of 100 die), visually inspect for the worst case metallization of the 2 dice, and take SEM photographs
of the worst case.

c) Subgroup 5 radiation tests. Subgroup 5 radiation tests are not required unless otherwise specified

in the detail purchase order.

3.3.2 Processes - Processes used for manufacturing the VCXO are selected on the basis of their ability to

meet the quality requirements for space High Reliability manufacturing. Travelers or Process Cards are
used in the manufacturing and testing of all of the VCXO Series, and might be available for customer
review. Copies of these Travelers can be provided with the VCXOs at time of shipment if so specified

on the purchase order.

3.3.3 Interchangeability - Each VCXO shall be interchangeable without using a special selection process.

3.3.4 Product Marking - Each unit shall be permanently marked with the manufacturer's name or symbol,

part number, lot date code number, and serial number. The unit shall be marked with the outline of an
equilateral triangle near pin 1 to show that it contains devices which are sensitive to electrostatic
discharge.

3.4

Parts Program

Devices delivered to this specification represent the standardized Parts, Materials and Processes (PMP)

Program developed, implemented and certified for advanced applications and extended environments.

3.4.1 Quartz Crystal Resonator - The crystal resonator used shall be constructed using a 4 point mount

premium synthetic swept Quartz and procured to Q-TECH SCD. (For the Engineering models, non-
swept quartz may be used).

3.5

Traceability Requirements

Material, element and process traceability requirements shall be as specified by MIL-PRF-38534 for
Class K hybrids.

3.6

Data

3.6.1. Design Documentation - When required by the purchase order, design, topography, process and flow

charts for all assembly/inspection and test operation for devices to be supplied under this specification
on the initial procurement shall be established and shall be available in-plant for review by the procuring
activity upon request. This design documentation shall be sufficient to depict the physical and electrical
construction of the devices supplied under the specification and shall be traceable to the specific parts,
drawings or part type numbers to which it applies, and to the production lot(s) and inspection lot codes
under which devices are manufactured and tested so that revisions can be identified.

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