2 innovative asus features, Innovative asus features -2 – Asus M4A77T User Manual

Page 12

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AMD

®

770 Chipset

The AMD

®

770 Chipset is designed to support up to 5200MT/s

HyperTransport™ 3.0 (HT 3.0) interface speed and PCI Express 2.0

x16 graphics. It is optimized with AMD’s latest AM3 multi-core CPUs to

provide excellent system performance and overclocking capabilities.

HyperTransport™ 3.0 support

HyperTransport™ 3.0 technology provides 2.6 times more bandwidth

than HT1.0 that radically improves system efficiency for a smoother and

faster computing environment.

AMD Cool ‘n’ Quiet Technology

This motherboard supports the AMD Cool ‘n’ Quiet technology which

monitors system operation and automatically adjusts CPU voltage and

frequency for a cool and quiet operating environment.

Dual-Channel DDR3 1800(O.C.) support

This motherboard supports DDR3 memory that features data transfer

rates of 1800 (O.C.)/1600 (O.C.)/1333/1066 MHz to meet the higher

bandwidth requirements of the latest operating system, 3D graphics,

multimedia, and Internet applications.

Serial ATA 3Gb/s technology and RAID support

This motherboard supports hard drives based on the Serial ATA (SATA)

3Gb/s storage specification, delivering enhanced scalability and doubling

the bus bandwidth for high-speed data retrieval and save. It also supports

RAID 0, RAID 1, and RAID 0+1 configurations for Serial ATA hard drives.

Gigabit LAN solution

The onboard LAN controller is a highly integrated Gb LAN controller. It is

enhanced with an ACPI management function to provide efficient power

management for advanced operating systems.

1.3.2

Innovative ASUS features

ASUS EPU

ASUS EPU is a unique power saving technology that detects the current

system loadings and adjusts the power consumption in real time.

ASUS Turbo Key

ASUS Turbo Key allows you to turn the PC power button into

an overclocking button. After the easy setup, Turbo Key boosts

performances without interrupting ongoing work or games, simply through

pressing the button.

Chapter 1: Product introduction

1-2

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