2 mounting micromodule – Interlink Electronics MicroModule USB User Manual

Page 8

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6

USB MicroModule

Integration Guide

5.2 Mounting

MicroModule

To panel mount the module without sealing, fabricate a panel designed with the necessary
cut-outs for the actuator and click buttons, and four or more fasteners (e.g., PEM studs,
edge clips, hole clips, heat stakes, etc.). When installing, MicroModule should be seated
evenly and the fasteners tightened evenly to avoid stressing the printed circuit board. Over
torque on the bolts should be avoided; this could crack the PCB and cause the module to
fail. It is recommended to use a PCB support bracket to apply even clamping pressure to
the MicroModule unit. With proper seating and tightening, a liquid and particulate resistant
interface can be created.

Note: The FSR is connected to the PCBA with Z-axis adhesive. This is an electrical, not
mechanical bond. A mechanical means of applying a compressive force to the joint should
be incorporated in the mounting of the MicroModule. This will prevent the delamination of
the adhesive, which can lead to an open circuit. If you follow the Interlink recommended
cut-out and PCB support bracket technique, the rubber keypad and the panel edge will be
used to apply pressure to the joint (See Figure 5).

Figure 5: Cross section view showing constant pressure being applied to the sensor contacts by

the module's case (panel) through an extension of the rubber keypad actuator

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