Rainbow Electronics W2465 - Manual (Page 10)

W2465
- 10 -
Package Dimensions, continued
28-pin SO Wide Body
1. Dimension D Max. & S include mold flash
or tie bar burrs.
2. Dimension b does not include dambar
protrusion/intrusion.
3. Dimension D & E include mold mismatch
and determined at the mold parting line.
.
0.25 0.20 0.010 0.008
Notes:
Symbol
Min. Nom. Max. Max. Nom. Min.
Dimension in Inches Dimension in mm
A
b
c
D
e
H
E
L
y
A
A
L
E
1
2
E
0.014 0.36
0.112 2.85
0.004
0.093
0.014
0.098
0.016
0.103
0.020
2.36
0.36
0.10
2.49
0.41
2.62
0.51
0.059
0.004
0 10
0.713
0.067
0.733
0.075 1.50
18.11
1.70
18.62
1.91
0.477 0.465 0.453 12.12 11.81 11.51
10 0
0.10
8.53 8.41 8.28 0.336 0.331 0.326
0.71 0.91 1.12 0.028 0.036 0.044
4. Controlling dimension: Inches.
5. General appearance spec should be based
on final visual inspection spec.
1.12 1.27 1.42 0.044 0.050 0.056
S 1.19 0.047
2
1 A
28 15
14 1
e S
E H
b
Seating Plane
A A
y L
L
e
c
See Detail F
D
E
E
1
1 e
Detail F
θ
Headquarters
No. 4, Creation Rd. III,
Science-Based Industrial Park,
Hsinchu, Taiwan
TEL: 886-3-5770066
FAX: 886-3-5792647
http://www.winbond.com.tw/
Voice & Fax-on-demand: 886-2-7197006
Taipei Office
11F, No. 115, Sec. 3, Min-Sheng East Rd.,
Taipei, Taiwan
TEL: 886-2-7190505
FAX: 886-2-7197502
Winbond Electronics (H.K.) Ltd.
Rm. 803, World Trade Square, Tower II,
123 Hoi Bun Rd., Kwun Tong,
Kowloon, Hong Kong
TEL: 852-27513100
FAX: 852-27552064
Winbond Electronics North America Corp.
Winbond Memory Lab.
Winbond Microelectronics Corp.
Winbond Systems Lab.
2730 Orchard Parkway, San Jose,
CA 95134, U.S.A.
TEL: 1-408-9436666
FAX: 1-408-9436668
Note: All data and specifications are subject to change without notice.