faytech Industrial Motherboard Series - Manual (Page 3)

BIOS setup
3.4 Advanced menu ............................................................................ 3-6
3.4.1
3.4.2
3.4.3
3.4.4
3.4.5
3.4.6
3.4.7
3.4.8
CPU Configuration ......................................................... 3-6
IDE Configuration ........................................................... 3-7
USB Configuration .......................................................... 3-7
APM ................................................................................ 3-7
Panel Controller (AMD ® GPU only) ................................. 3-8
North Bridge LVDS Config Select (AMD ® GPU only) ....... 3-8
Onboard Devices Configuration ...................................... 3-8
DIO Function ................................................................... 3-8
iii
Central Processing Unit (CPU) ..................................................... 2-6
System memory ............................................................................ 2-6
Jumpers ........................................................................................ 2-8
Connectors ................................................................................... 2-12
2.7.1
2.7.2
Rear panel connectors .................................................. 2-12
Internal connectors ........................................................ 2-13
Chapter 3:
3.1
3.2
3.3
BIOS setup program ..................................................................... 3-1
BIOS menu screen ....................................................................... 3-2
Main menu .................................................................................... 3-4
3.3.1
3.3.2
3.3.3
3.3.4
System Language [English] ........................................... 3-4
System Date [Day xx/xx/xxxx] ........................................ 3-4
System Time [xx:xx:xx] ................................................... 3-4
Security .......................................................................... 3-4
Contents
Chapter 1:
1.1
1.2
Package contents ......................................................................... 1-1
Specifications ................................................................................ 1-2
Before you proceed ....................................................................... 2-1
Motherboard layout ....................................................................... 2-2
Screw size ..................................................................................... 2-4
2.3.1
2.3.2
Component side ............................................................. 2-4
Solder side ..................................................................... 2-5
Features ........................................................................................ 1-1
Product overview
1.3
2.1
Chapter 2:
2.2
2.3
Motherboard information
2.4
2.5
2.6
2.7