Document Outline

• 1. Pin Descriptions - Software (Hardware) Mode
  • 1.1 Digital I/O Pin Characteristics
    • Table 1. I/O Power Rails
• 2. Typical Connection Diagrams
  • Figure 1. Typical Connection Diagram (Software Mode)
  • Figure 2. Typical Connection Diagram (Hardware Mode)
• 3. Characteristic and Specification Tables
  • Specified Operating Conditions
  • Absolute Maximum Ratings
  • Analog Characteristics (Commercial - CNZ)
  • Analog Characteristics (Automotive - DNZ)
  • ADC Digital Filter Characteristics
  • Switching Specifications - Serial Port
    • Figure 3. Serial Audio Interface Slave Mode Timing
    • Figure 4. Serial Audio Interface Master Mode Timing
  • Switching Specifications - I·C Control Port
    • Figure 5. Control Port Timing - I·C
  • Switching Characteristics - SPI Control Port
    • Figure 6. Control Port Timing - SPI Format
  • DC Electrical Characteristics
  • Digital Interface Specifications & Characteristics
  • Power Consumption
• 4. Applications
  • 4.1 Overview
    • 4.1.1 Architecture
    • 4.1.2 Line & MIC Inputs
    • 4.1.3 Signal Processing Engine
    • 4.1.4 Device Control (Hardware or Software Mode)
    • 4.1.5 Power Management
  • 4.2 Hardware Mode
    • Table 2. Hardware Mode Feature Summary
  • 4.3 Analog Inputs
    • Figure 7. Analog Input Architecture
    • 4.3.1 Digital Code, Offset & DC Measurement
    • 4.3.2 High-Pass Filter and DC Offset Calibration
    • 4.3.3 Digital Routing
    • 4.3.4 Differential Inputs
      • Figure 8. MIC Input Mix w/Common Mode Rejection
      • Figure 9. Differential Input
    • 4.3.5 Analog Input Multiplexer
    • 4.3.6 MIC & PGA Gain
    • 4.3.7 Automatic Level Control (ALC)
      • Figure 10. ALC
    • 4.3.8 Noise Gate
      • Figure 11. Noise Gate Attenuation
  • 4.4 Signal Processing Engine
    • Figure 12. Signal Processing Engine
    • 4.4.1 Volume Controls
    • 4.4.2 Mono Channel Mixer
  • 4.5 Serial Port Clocking
    • 4.5.1 Slave
      • Table 3. MCLK/LRCK Ratios
    • 4.5.2 Master
      • Figure 13. Master Mode Timing
    • 4.5.3 High-Impedance Digital Output
      • Figure 14. Tri-State Serial Port
    • 4.5.4 Quarter- and Half-Speed Mode
  • 4.6 Digital Interface Formats
    • Figure 15. I·S Format
    • Figure 16. Left-Justified Format
  • 4.7 Initialization
  • 4.8 Recommended Power-Up Sequence
  • 4.9 Recommended Power-Down Sequence
    • Figure 17. Initialization Flow Chart
  • 4.10 Software Mode
    • 4.10.1 SPI Control
      • Figure 18. Control Port Timing in SPI Mode
    • 4.10.2 I·C Control
      • Figure 19. Control Port Timing, I·C Write
      • Figure 20. Control Port Timing, I·C Read
    • 4.10.3 Memory Address Pointer (MAP)
• 5. Register Quick Reference
• 6. Register Description
  • 6.1 Chip I.D. and Revision Register (Address 01h) (Read Only)
  • 6.2 Power Control 1 (Address 02h)
  • 6.3 MIC Power Control & Speed Control (Address 03h)
  • 6.4 Interface Control (Address 04h)
  • 6.5 MIC Control (Address 05h)
  • 6.6 ADC Control (Address 06h)
  • 6.7 ADCx Input Select, Invert & Mute (Address 07h)
    • Figure 21. AIN & PGA Selection
  • 6.8 SPE Control (Address 09h)
  • 6.9 ALCX & PGAX Control: ALCA, PGAA (Address 0Ah) & ALCB, PGAB (Address 0Bh)
  • 6.10 ADCx Attenuator: ADCA (Address 0Ch) & ADCB (Address 0Dh)
  • 6.11 ADCx Mixer Volume Control: ADCA (Address 0Eh) & ADCB (Address 0Fh)
  • 6.12 Channel Mixer (Address 18h)
  • 6.13 ALC Enable & Attack Rate (Address 1Ch)
  • 6.14 ALC Release Rate (Address 1Dh)
  • 6.15 ALC Threshold (Address 1Eh)
  • 6.16 Noise Gate Configuration & Misc. (Address 1Fh)
  • 6.17 Status (Address 20h) (Read Only)
• 7. Analog Performance Plots
  • 7.1 ADC_FILT+ Capacitor Effects on THD+N
    • Figure 22. ADC THD+N vs. Frequency w/Capacitor Effects
• 8. Example System Clock Frequencies
  • 8.1 Auto Detect Enabled
  • 8.2 Auto Detect Disabled
• 9. PCB Layout Considerations
  • 9.1 Power Supply, Grounding
  • 9.2 QFN Thermal Pad
• 10. Digital Filters
  • Figure 23. ADC Passband Ripple
  • Figure 24. ADC Stopband Rejection
  • Figure 25. ADC Transition Band
  • Figure 26. ADC Transition Band Detail
• 11. Parameter Definitions
• 12. Package Dimensions
  • Thermal Characteristics
• 13. Ordering Information
• 14. References
• 15. Revision History