Texas Instruments MSP50C614 User Manual

Page 387

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Mechanical Information

7-5

Customer Information

The C614 is sold in die form for its volume production. For software develop-
ment and prototyping, a windowed ceramic 120 pin grid array packaged P614
is available. The P614’s PGA package is shown in Figure 7–2.

Figure 7–2. 120-Pin Grid Array Package for the Development Device, P614

extra pin

1 2 3 4 5 6 7 8 9

N

M

L

K
J
H

G

F
E

D

C

B
A

10 9 8 7 6 5 4 3 2 1

N

M

L

K

J

H
G

F

E
D
C

B
A

(BOTTOM VIEW)

(TOP VIEW)

11

12

13

11 12 13

10

Note:

The PGA package is only available in limited quantities for development
purposes.

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