Intel 41210 User Manual
Page 17
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Intel® 41210 Serial to Parallel PCI Bridge Design Guide
17
Package Information
Figure 7. Side View - 41210 Bridge 567-Ball FCBGA Package Dimensions
B2712-01
1.170 – 0.085
H
1.940 – 0.150
J
Die
FC BGA Substrate
0.100 – 0.025
Die Solder
Bumps
Underfill
Epoxy
0.74 – 0.025
Detail H
Scale 5:1
Detail J
Scale 5:1
0.600 – 0.100
BGA Solder Balls
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