Mechanical overview – Intel Entry Redundant Power 2U ERP2U User Manual

Page 7

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SSI

ERP2U Power Supply Design Guide, V1.0

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4

Mechanical Overview

STATUS

Required (Optional)

Note: Some features are noted as optional in the enclosure drawing figure below. These features may be use in
some chassis designs where only top access is allowed for the cage mounting.

The ERP2U is a power sub-system made up of a cage and redundant, hot swappable power supply modules. A
mechanical drawing of the cage is shown below in Figure 1. This cage is intended to be mounted in the system
and not redundant or hot swappable. The exterior face of the cage accepts hot swappable power supply
modules. The cage distributes output power from the modules to a wire harness. Cooling fans may be located in
the modules or cage. If the cooling fans are located in the cage, they may optionally be redundant. If the cage
has redundant cooling the cage depth may be extended to allow for the additional series fan. A recommended
power supply module solution is the SSI TPS power supply. Refer to

www.ssiforum.org

for the latest TPS Design

Guide. The cage may have IEC inlet connector(s) and EMI filtering to distribute AC power to the power supply
modules or the AC may plug directly into the modules. Three different configurations of the power sub-system
are also shown below in Figure 1.

Figure 1: Enclosure Drawing

Power Module

Configuration Options

Module Module

AC

AC

Module

AC

Module

AC

Module

Module

AC

AC

SSI TPS Power Supply Configuration

No Fans in modules

AC inlets and EMI filter in cage

Optional Dual AC Inlets

Optional 3.3V, 5V DC/DC converters in cage

Vertical Power Supply Configuration

Fans in modules

AC inlets on modules

Dual AC Inlets

Optional 3.3V, 5V DC/DC converters in cage

Horizontal Power Supply Configuration

Fans in modules

AC inlets on modules

Dual AC Inlets

Optional 3.3V, 5V DC/DC converters in cage

Allow for 1.2mm

protrusion (x4)

Optional mounting features for top access

mounting of the power supply.

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