Teledyne LeCroy Summit T3-16 PCIe Multi-lane Protocol Analyzer User Manual - Manual (Page 27)

Summit T3‐16 PCI Express Multi‐Lane Protocol Analyzer User Manual 15
Using Interposers Teledyne LeCroy
3.8 Using Interposers
Figure 3.10: Connecting the Summit T3-16 Analyzer to the Device Under Test Using a Gen2
Passive Interposer
3.8.1 Summit T3-16 Components
Summit T3‐16 components used in the installation are:
 iPass Y‐Cable: The cable supports eight lanes from two directions. Side A of the
probe cable connects to the Upstream port on the Analyzer (on the left in the
photo above), and Side B of the probe cable connects to the Downstream port
(on the right).
Note: x16 recordings require two cables.
 Summit T3‐16 x16 Slot Gen2 Passive Interposer: The slot Interposer provides
the point of attachment for the Analyzer to the Device Under Test (DUT). The
Interposer is designed to fit between a motherboard and one of its device cards ‐
for example, a LAN card. The Interposer has three sets of connectors: a gold male
connector that fits into a standard x16 PCI Express slot on a motherboard, a PCIe
female connector that accepts a x16 PCI Express device, and two Interposer
cable connectors that connect the Interposer to the Analyzer.
3.8.2 Installing the Gen2 Passive Interposer
To install the Interposer, perform the following steps:
1. Insert the gold male connector on the Interposer probe into a x16 PCI Express slot in
the motherboard. Use edge adapters for x1, x4, and x8 slots.
2. Insert the PCI Express DUT into the Interposer’s PCIe female device connector.
3. The slot Interposer is shipped from Teledyne LeCroy with a metal face plate for
attachment to the host machine’s enclosure. If you are working with a motherboard
that is not in the host machine’s enclosure, you may prefer to remove the metal face
plate so the Interposer can sit flat with the motherboard. To remove the face plate,
unscrew the two screws that hold it onto the Interposer.